| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 5 | |
| #2 | Singapore | 2 | |
| #3 | China | 1 | |
| #4 | EPO (European Patent Office) | 1 | |
| #5 | United States | 1 | |
| #6 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Tan Hien Boon | 5 |
| #2 | Kolan Ravi Kanth | 5 |
| #3 | Bidin Rahamat | 4 |
| #4 | Chong Desmond Yok Rue | 3 |
| #5 | Sun Yi Sheng Anthony | 3 |
| #6 | Sun Yi-Sheng Anthony | 2 |
| #7 | Sun Anthony Yi Sheng | 2 |
| #8 | Wang Chuen Khiang | 2 |
| #9 | Rodel Manalac | 2 |
| #10 | Tanary Susanto | 1 |
| Publication | Filing date | Title |
|---|---|---|
| SG152281A1 | Chip scale package and method of assembling the same |