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UNIMICRON CORP

Overview
  • Total Patents
    22
About

UNIMICRON CORP has a total of 22 patent applications. Its first patent ever was published in 2005. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are JIANGYIN XINSHUN MICROELECTRONIC CO LTD, MIKROELEKTRONIK WILHELM PIECK and NII PULSAR.

Patent filings in countries

World map showing UNIMICRON CORPs patent filings in countries
# Country Total Patents
#1 China 22

Patent filings per year

Chart showing UNIMICRON CORPs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Zhenhua Zheng 5
#2 Chengbo Yu 5
#3 Shusheng Jiang 4
#4 Zongyuan Chen 4
#5 Zhimin Zhang 3
#6 Shaoqian Li 3
#7 Zhipeng Fan 2
#8 Zizhang Zeng 2
#9 Qimin Zhang 2
#10 Zhenquan Zhang 1

Latest patents

Publication Filing date Title
CN101626026A Encapsulation structure and method thereof of image sensing chip
CN101587842A Chip packaging support plate and manufacture method thereof
CN101588678A Method for forming welding resisting layer
CN101562945A Buried line structure and manufacture method thereof
CN101500371A Circuit board and its producing method
CN101483977A Circuit board and manufacturing method thereof
CN101426345A Circuit board manufacturing method and construction thereof
CN101409981A Circuit board with imbedded capacitance and electric resistance structure
CN101388374A Chip package substrate and projection welding plate construction
CN101360398A Circuit board construction of inner fovea type conductive column and preparation thereof
CN101355845A Substrate with conductive projection and technique thereof
CN101351092A Inside imbedded type line board technique with conductive hole
CN101351084A Circuit board and metal surface treatment technique thereof
CN101351091A Line connection technique and structure thereof
CN101299902A Circuit structure of circuit board and circuit technique thereof
CN101299905A Circuit board and manufacturing method thereof
CN101277591A Inner embedded type circuit board and method for manufacturing the same
CN101150111A Encapsulation base plate
CN101134190A Jet printing technique for the metal surface treatment
CN101136385A Internally burying type chip packaging manufacture process and circuit board having the same