ASIA ELECTRONIC MATERIAL CO has a total of 13 patent applications. Its first patent ever was published in 2007. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets audio-visual technology, optics and machines are KOMATSU GIKEN KK, YU CHENG-PO and U AI ELECTRONICS CORP.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 9 | |
#2 | China | 2 | |
#3 | United States | 2 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Optics | |
#3 | Machines |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Unspecified technologies | |
#3 | Optical systems |
# | Name | Total Patents |
---|---|---|
#1 | Lee Chien Hui | 8 |
#2 | Lin Chih Ming | 7 |
#3 | Hsiang Fu Di | 5 |
#4 | Lin Chih-Ming | 3 |
#5 | Lee Chien-Hui | 3 |
#6 | Zhiming Lin | 2 |
#7 | Chiu Chen Hsiung | 2 |
#8 | Tung Po Jen | 2 |
#9 | Jianhui Li | 2 |
#10 | Hsiao Jen Hsiung | 2 |
Publication | Filing date | Title |
---|---|---|
US2016113162A1 | Cover film | |
TW201317274A | Polyimide copolymer and its preparation and coating film | |
US2010330321A1 | Cover layer for printed circuit board | |
TW200936031A | A mask structure and a flexible printed circuit board having the mask structure | |
CN101437358A | Protection film for printed circuit board and procedure for processing circuit board using the protection film | |
CN101296557A | Flexible printing circuit board | |
TW200841778A | Flexible printed circuit boards | |
TW200841779A | Copper clad laminate for manufacturing flexible printed circuit board and the method for making the same |