DYNAMIC DETAILS INC has a total of 16 patent applications. Its first patent ever was published in 2007. It filed its patents most often in China, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets audio-visual technology and machines are U AI ELECTRONICS CORP, RES ORGANIZATION FOR CIRCUIT K and FUKU PREC COMPONENTS SHENZHEN.
# | Country | Total Patents | |
---|---|---|---|
#1 | China | 4 | |
#2 | EPO (European Patent Office) | 4 | |
#3 | WIPO (World Intellectual Property Organization) | 3 | |
#4 | United States | 2 | |
#5 | Hong Kong | 1 | |
#6 | Republic of Korea | 1 | |
#7 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Machines |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Unspecified technologies |
# | Name | Total Patents |
---|---|---|
#1 | Taylor Michael J | 8 |
#2 | Dreyer Monte | 7 |
#3 | Kumar Raj | 7 |
#4 | Sidhu Rajwant Singh | 5 |
#5 | Zepeda Ruben | 4 |
#6 | Monte Dreyer | 2 |
#7 | Raj Kumar | 2 |
#8 | Walker Paul | 2 |
#9 | Sidhu Rajwant | 2 |
Publication | Filing date | Title |
---|---|---|
TW201106826A | Additional functionality single lamination stacked via with plated through holes for multilayer printed circuit boards | |
KR20110050515A | Additional functionality single lammination stacked via with plated through holes for multilayer printed circuit boards | |
CN101802261A | Multilayer printed wiring boards with holes requiring copper wrap plate | |
EP2416635A1 | Multilayer printed wiring boards with copper filled through-holes | |
US2007246254A1 | Methods of manufacturing printed circuit boards with stacked micro vias |