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Tianshui tianguang semiconductor co ltd

Overview
  • Total Patents
    24
  • GoodIP Patent Rank
    158,938
  • Filing trend
    0.0%
About

Tianshui tianguang semiconductor co ltd has a total of 24 patent applications. It increased the IP activity by 0.0%. Its first patent ever was published in 2009. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, surface technology and coating and electrical machinery and energy are OTSUKA MANABU, KUZNETSOV OLEG A and OLEDON CO LTD.

Patent filings in countries

World map showing Tianshui tianguang semiconductor co ltds patent filings in countries
# Country Total Patents
#1 China 24

Patent filings per year

Chart showing Tianshui tianguang semiconductor co ltds patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhang Zhixiang 8
#2 Du Linde 7
#3 Xu Qiangang 7
#4 Lin Wang 6
#5 Yang Hong 4
#6 Yuzhong Wang 4
#7 Zhang Xiaoqing 4
#8 Xue Jianguo 3
#9 Meiyu Huang 3
#10 Xiaoqing Zhang 3

Latest patents

Publication Filing date Title
CN111627826A Method for welding metal structure on front surface of semiconductor chip
CN111341650A Bubble-emitting phosphorus diffusion process method for reducing triode reverse amplification factor
CN111276393A Manufacturing method of wafer-level packaging transient voltage suppression diode
CN111244037A Integrated manufacturing method of reverse voltage 40V or 60V bridge rectifier circuit
CN108486554A A kind of Electroless Plating Ni on semiconductor silicon device, the technique of Au
CN107833834A A kind of manufacture method of transient voltage suppression diode chip
CN105355554A 100V Schottky diode table-board manufacturing method
CN105336606A 40 V Schottky diode manufacturing process capable of reducing secondary breakdown ratio
CN105182683A Method for preparing plasma enhanced chemical vapor deposition (PECVD) silicon nitride protective film on surface of photoetching mask
CN104576362A Fabrication process of 100V Schottky diode
CN104022025A High-voltage-resistant pulse width modulation controller terminal manufacturing method
CN103579217A Power module packaged in ultra-small mode and packaging method thereof
CN103579158A Eutectic bonding silicon metalized metal piece and metallization process thereof
CN104078371A Reballing method for inverted packaging of semiconductor integrated circuit or discrete device
CN104078367A Manufacturing technology of reversely-packaged Schottky diode salient points
CN102931070A Silicon substrate isotropic wet etching process
CN102938374A Phosphorus penetration process for semiconductor discrete device wafer-level packaging
CN101908504A Abrupt-junction voltage stabilizing diode made of polysilicon and manufacture process thereof
CN101908493A Process for producing hybrid integrated circuit
CN102110590A Method for using deionized water as wetting agent in oxide corrosion of semiconductor device