| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Germany | 4 | |
| #2 | China | 3 | |
| #3 | Republic of Korea | 3 | |
| #4 | Singapore | 2 | |
| #5 | WIPO (World Intellectual Property Organization) | 2 | |
| #6 | EPO (European Patent Office) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Surface technology and coating |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Layered products |
| # | Name | Total Patents |
|---|---|---|
| #1 | Richter Franz | 11 |
| #2 | Piekass Madeleine | 4 |
| #3 | Gross Andreas | 4 |
| #4 | Luible Andreas | 3 |
| #5 | Pamler Werner | 3 |
| #6 | Richter Franz Dr | 2 |
| #7 | Pamler Werner Dr | 1 |
| #8 | Andreas Luible | 1 |
| #9 | Jakob Andreas | 1 |
| #10 | Franz Richter | 1 |
| Publication | Filing date | Title |
|---|---|---|
| DE102010062166A1 | Method for treating wafers and microplates | |
| DE102008055155A1 | Separation method for a layer system comprising a wafer | |
| DE102008044200A1 | Bonding method | |
| DE102006004834A1 | Process for treating wafers during thinning |