| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 18 |
| # | Industry | |
|---|---|---|
| #1 | Audio-visual technology | |
| #2 | Semiconductors | |
| #3 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Casings and printed circuits | |
| #2 | Semiconductor devices | |
| #3 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Maeda Shinnosuke | 18 |
| #2 | Hirano Satoshi | 11 |
| #3 | Suzuki Tetsuo | 5 |
| #4 | Hando Takuya | 3 |
| #5 | Ito Tatsuya | 3 |
| #6 | Sugimoto Atsuhiko | 2 |
| #7 | Asano Toshiya | 1 |
| #8 | Saiki Hajime | 1 |
| #9 | Torii Takuya | 1 |
| #10 | Shiiba Yuuki | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2012312590A1 | Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate | |
| US2012018194A1 | Multilayer wiring board and manufacturing method thereof |