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TAIWAN ELECTRONIC PACKAGING CO

Overview
  • Total Patents
    16
About

TAIWAN ELECTRONIC PACKAGING CO has a total of 16 patent applications. Its first patent ever was published in 2001. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets semiconductors and environmental technology are WANG CHUNG YU, YIN HAIZHOU and YOSHIDA ISAMU.

Patent filings in countries

World map showing TAIWAN ELECTRONIC PACKAGING COs patent filings in countries
# Country Total Patents
#1 Taiwan 10
#2 China 3
#3 United States 2
#4 EPO (European Patent Office) 1

Patent filings per year

Chart showing TAIWAN ELECTRONIC PACKAGING COs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Wu Cheng-Jiau 10
#2 Chen Shin-Ju 4
#3 Chengjiao Wu 3
#4 Wu Cheng-Chiao 3
#5 Chen Shin-Chu 1

Latest patents

Publication Filing date Title
CN101770995A Chip module structure assembly
CN101661967A Structural assembly of solar panel
CN101197383A Locate accurate image chip encapsulating structure
TW200717733A Image chip package structure and packaging method thereof
TW200428616A Package for integrated circuit chip
US2002089039A1 IC chip package
TW515069B Lead frame structure
TW501248B Chip package structure
TW504810B Chip package with low stress
TW504809B Chip package with reduced stress
TW498494B Modularized packaging for integrated circuit chip
TWI249210B Chip package structure
TW501241B Chip package structure with protection effect
TW480684B Package of IC chip