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TAIJI SEMICONDUCTOR SUZHOU CO LTD

Overview
  • Total Patents
    15
  • GoodIP Patent Rank
    116,580
  • Filing trend
    ⇩ 75.0%
About

TAIJI SEMICONDUCTOR SUZHOU CO LTD has a total of 15 patent applications. It decreased the IP activity by 75.0%. Its first patent ever was published in 2017. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, materials and metallurgy and micro-structure and nano-technology are CHIPBOND TECH CORP, SEKINE SHIGENOBU and LITECOOL LTD.

Patent filings in countries

World map showing TAIJI SEMICONDUCTOR SUZHOU CO LTDs patent filings in countries
# Country Total Patents
#1 China 15

Patent filings per year

Chart showing TAIJI SEMICONDUCTOR SUZHOU CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhang Guangming 10
#2 Ma Jun 8
#3 Yang Fangfang 6
#4 Liu Peng 5
#5 Zhu Yunkang 3
#6 Lu Haiqin 2
#7 Li Feng 2
#8 Wang Ting 2
#9 Yang Jian 2
#10 Zhu Deying 1

Latest patents

Publication Filing date Title
CN111627836A Chip packaging structure and packaging method thereof
CN111629578A Memory bank packaging assembly and manufacturing method thereof
CN111584407A Embedded chip packaging structure and using method thereof
CN111545765A Method for preparing tin ball with uniform ball diameter and good sphericity
CN110767617A Sealing cover balanced filling packaging structure and process for sorting flip chip
CN110767616A Sealing cover high-heat-conductivity packaging structure for sorting flip chip and packaging process thereof
CN110867388A Anti-adhesive sectional type chip press-fit mold
CN110759311A Leadless MEMS chip packaging structure based on window type substrate and process thereof
CN110646430A Wafer inspection tool
CN110867422A CLGA packaging carrier for ceramic grid array
CN108493163A A kind of chip-packaging structure and its technique based on slip formula rigid frame
CN107845600A A kind of bonded wafer level packaging structure and its technological process
CN107342250A A kind of portable 360 degree of dust suction diamonds mark carves the tool of pen
CN107369642A A kind of suction method for being avoided that ultra-thin chip fragmentation
CN107301993A It is a kind of to increase the encapsulating structure and its manufacture craft of non-functional chip