| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 11 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Casings and printed circuits |
| # | Name | Total Patents |
|---|---|---|
| #1 | Chen Nan-Jang | 11 |
| #2 | Lin Hong-Chin | 3 |
| #3 | Wong Yau-Wai | 2 |
| #4 | Chang Sheng-Ming | 1 |
| #5 | Chang Chun-Wei | 1 |
| #6 | Jao Che-Yuan | 1 |
| #7 | Chen Nan-Cheng | 1 |
| #8 | Li Ching-Chih | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2011248394A1 | Leadframe package for high-speed data rate applications | |
| US2011176345A1 | Electronic apparatus | |
| US2010123226A1 | Semiconductor package | |
| US2009253278A1 | Printed circuit board | |
| US2009251876A1 | Printed circuit board | |
| US2008211068A1 | Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product |