| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 17 | |
| #2 | China | 13 | |
| #3 | Republic of Korea | 5 | |
| #4 | United States | 4 | |
| #5 | Taiwan | 2 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Audio-visual technology | |
| #3 | Micro-structure and nano-technology | |
| #4 | Electrical machinery and energy | |
| #5 | Optics | |
| #6 | Surface technology and coating | |
| #7 | Machine tools |
| # | Name | Total Patents |
|---|---|---|
| #1 | Hsieh Chin Tang | 8 |
| #2 | Ho Fu-Yen | 7 |
| #3 | Shih Cheng-Hung | 7 |
| #4 | Chen Yen-Ting | 7 |
| #5 | Lin Shu-Chen | 5 |
| #6 | Hsieh Yung-Wei | 5 |
| #7 | Shii Cheng-Hung | 5 |
| #8 | Hsieh Chin-Tang | 5 |
| #9 | Wu Kuo-Hsuan | 4 |
| #10 | Chen Wen-Yung | 4 |
| Publication | Filing date | Title |
|---|---|---|
| TWI570854B | Semiconductor package structure having hollow chamber, bottom substrate and manufacturing process thereof | |
| TW201606453A | Method for photoresist stripping |