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SUPERUFO291 TEC

Overview
  • Total Patents
    11
  • GoodIP Patent Rank
    160,228
About

SUPERUFO291 TEC has a total of 11 patent applications. Its first patent ever was published in 2015. It filed its patents most often in WIPO (World Intellectual Property Organization), EPO (European Patent Office) and United States. Its main competitors in its focus markets materials and metallurgy, surface technology and coating and semiconductors are DOWA ELECTRONICS MATERIALS CO LTD, DOWA ELECTRONICS MAT CO and LS-NIKKO COPPER INC.

Patent filings in countries

World map showing SUPERUFO291 TECs patent filings in countries
# Country Total Patents
#1 WIPO (World Intellectual Property Organization) 6
#2 EPO (European Patent Office) 2
#3 United States 2
#4 China 1

Patent filings per year

Chart showing SUPERUFO291 TECs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Fukui Akira 11
#2 Fukui Toshie 2

Latest patents

Publication Filing date Title
WO2020130039A1 Semiconductor device joining member
WO2019230252A1 Highly thermal conductive electrically-insulative composite member and semiconductor module
WO2018190023A1 Heat dissipation substrate, heat dissipation substrate electrode, semiconductor package, and semiconductor module
WO2018020695A1 Heat dissipation substrate, semiconductor package, semiconductor module and heat dissipation substrate manufacturing method
WO2016088687A1 Heat-dissipating substrate and method for manufacturing same
WO2016056637A1 Heat dissipation substrate and method for manufacturing said heat dissipation substrate