| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 4 | |
| #2 | EPO (European Patent Office) | 3 | |
| #3 | United States | 3 | |
| #4 | Republic of Korea | 2 | |
| #5 | China | 1 | |
| #6 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Materials and metallurgy | |
| #2 | Machine tools | |
| #3 | Semiconductors | |
| #4 | Surface technology and coating | |
| #5 | Thermal processes | |
| #6 | Mechanical elements |
| # | Technology | |
|---|---|---|
| #1 | Alloys | |
| #2 | Working metallic powder | |
| #3 | Layered products | |
| #4 | Semiconductor devices | |
| #5 | Rolling metal | |
| #6 | Soldering, welding and flame cutting | |
| #7 | Metal-working | |
| #8 | Changing non-ferrous metals | |
| #9 | Heat-exchange device details | |
| #10 | Clutches and brakes |
| # | Name | Total Patents |
|---|---|---|
| #1 | Terao Hoshiaki | 14 |
| #2 | Hashimoto Kouichi | 11 |
| #3 | Wada Raita | 4 |
| #4 | Nakatsuji Tsuyoshi | 3 |
| #5 | Shinagawa Yoshinori | 3 |
| Publication | Filing date | Title |
|---|---|---|
| WO2021040030A1 | Heat dissipation plate, semiconductor package and semiconductor module | |
| US2020263750A1 | Sintered friction material for brake |