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JFE SEIMITSU KK

Overview
  • Total Patents
    25
  • GoodIP Patent Rank
    181,474
  • Filing trend
    ⇩ 33.0%
About

JFE SEIMITSU KK has a total of 25 patent applications. It decreased the IP activity by 33.0%. Its first patent ever was published in 2002. It filed its patents most often in Japan. Its main competitors in its focus markets materials and metallurgy, semiconductors and surface technology and coating are JFE PREC CORPORATION, JFE PREC CORP and HAKUSAN INC.

Patent filings in countries

World map showing JFE SEIMITSU KKs patent filings in countries
# Country Total Patents
#1 Japan 25

Patent filings per year

Chart showing JFE SEIMITSU KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Terao Seimei 23
#2 Kohiki Hideaki 13
#3 Ota Hiroki 10
#4 Hashimoto Koichi 5
#5 Sawai Takashi 3
#6 Abumita Tetsuo 3
#7 Tajima Hidenori 2
#8 Uenosono Satoshi 2
#9 Sakurai Masahiko 2
#10 Imai Naotake 2

Latest patents

Publication Filing date Title
JP2020004963A Heat sink and manufacturing method thereof
JP2019096860A Radiator plate and manufacturing method for the same
JP2019096654A Radiator plate and manufacturing method for the same
JP2019079978A Heat sink and manufacturing method thereof
JP2019029631A Heat radiation plate and manufacturing method thereof
JP2018003135A Sintered tungsten-based alloy and manufacturing method therefor
JP2012007191A Sintered tungsten base alloy
JP2010163687A Cr-Cu ALLOY FOR CONDUCTING MEMBER FOR ELECTRONIC COMPONENT, METHOD FOR PRODUCING Cr-Cu ALLOY, LEAD FRAME OR BUS BAR USING THE Cr-Cu ALLOY AND METHOD FOR PRODUCING THE SAME
JP2011082350A Heat dissipation substrate component for electronic equipment
JP2010126791A Heat dissipation material, heat dissipation plate for semiconductor and heat dissipation component for semiconductor using the same, and method for producing heat dissipation material
JP2009149967A Cr-cu alloy sheet, and heat-radiating sheet and heat-radiating part for electronic apparatus using this sheet
JP2008057032A Cr-Cu ALLOY, MANUFACTURING METHOD THEREFOR, RADIATION PLATE FOR SEMICONDUCTOR AND RADIATION PARTS FOR SEMICONDUCTOR
JP2008142761A Cold temper rolling method for copper alloy sheet
JP2007242891A Heat radiator plate of copper or copper-contained alloy, and its joining method
JP2007035985A Heat sink used by electronic apparatus, and its manufacturing method
JP2005330583A Cu-Cr ALLOY AND Cu-Cr ALLOY PRODUCTION METHOD
JP2006258765A Tool for shielding radiation
JP2006015324A Vibration generator and manufacturing method therefor
JP2005154859A Coat film, and method of producing the same
JP2004162105A Hard film having excellent wear resistance and oxidation resistance, and product obtained by using the film