MICROMODULE SYSTEMS INC has a total of 31 patent applications. Its first patent ever was published in 1992. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, measurement and audio-visual technology are FORMFACTOR INC, KUMAR ANANDA H and HEI INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 12 | |
#2 | WIPO (World Intellectual Property Organization) | 10 | |
#3 | EPO (European Patent Office) | 6 | |
#4 | Taiwan | 2 | |
#5 | Australia | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Measurement | |
#3 | Audio-visual technology | |
#4 | Electrical machinery and energy | |
#5 | Surface technology and coating | |
#6 | Machines | |
#7 | Computer technology |
# | Name | Total Patents |
---|---|---|
#1 | Min Byoung-Youl | 8 |
#2 | Mok Sammy L | 7 |
#3 | Liu Ken Kuang-Fu | 6 |
#4 | Ho Chung W | 5 |
#5 | Griswold Bradley L | 5 |
#6 | Sato Takashi | 4 |
#7 | Husain Syed A | 4 |
#8 | Robinette Jr William C | 4 |
#9 | Griswold Brad | 3 |
#10 | Robinette William C | 3 |
Publication | Filing date | Title |
---|---|---|
US5796164A | Packaging and interconnect system for integrated circuits | |
AU4926396A | Multiple chip module mounting assembly and computer using same | |
US5729433A | Multiple chip module assembly for top of mother board | |
US5876580A | Rough electrical contact surface | |
WO9613967A1 | Programmable high density electronic testing device | |
WO9607924A1 | Membrane probing of circuits | |
WO9607921A1 | Membrane probing of circuits | |
WO9607143A1 | Dual-microprocessor module having two microprocessors each capable of operating in independent mode and cooperative mode | |
US5619399A | Multiple chip module mounting assembly and computer using same | |
TW261692B | Membrane probing of circuits | |
US5422514A | Packaging and interconnect system for integrated circuits | |
US5402077A | Bare die carrier |