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LINGSEN PREC IND CO LTD

Overview
  • Total Patents
    11
About

LINGSEN PREC IND CO LTD has a total of 11 patent applications. Its first patent ever was published in 2002. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are HUAYU COMP CO LTD, YINGXINDA CO LTD and MICROELECTRONIC CT CHINESE ACA.

Patent filings in countries

World map showing LINGSEN PREC IND CO LTDs patent filings in countries
# Country Total Patents
#1 China 11

Patent filings per year

Chart showing LINGSEN PREC IND CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Chongmao Ye 3
#2 Jiongyue Tian 3
#3 Xu Chengxiang 1
#4 Yingyan Zhang 1
#5 Tongyue Tian 1
#6 Renquan Ye 1
#7 Huang Jinqing Du 1
#8 Mucan Liao 1
#9 Huang Jinqing Tian 1

Latest patents

Publication Filing date Title
CN102214771A Lead-frame-type multi-chip bearing module for precast mold molding
CN102153044A Micro electro-mechanical system encapsulation module
CN101625980A Flip-chip method utilizing light curable glue
CN101552226A Stacked chip packaging method
CN101546712A Method for packaging semiconductor with cavity
CN101217139A Packaging structure to reduce noise jamming
CN101214918A Packaging structure used for micro-electromechanical capping process
CN101217860A A micro electro-mechanical shielding structure to reduce noise jamming
CN101018424A Microphone audio header structure
CN101018423A Microphone encapsulation structure
CN1466230A Method of package formation for LED and finished product structure thereof