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LIYANG HONGXIANG MACHINERY MFG CO LTD

Overview
  • Total Patents
    11
  • GoodIP Patent Rank
    233,907
About

LIYANG HONGXIANG MACHINERY MFG CO LTD has a total of 11 patent applications. Its first patent ever was published in 2010. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are SHIMIZU HIROJI, CHANG WAH TECH CO LTD and JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO LTD.

Patent filings in countries

World map showing LIYANG HONGXIANG MACHINERY MFG CO LTDs patent filings in countries
# Country Total Patents
#1 China 11

Patent filings per year

Chart showing LIYANG HONGXIANG MACHINERY MFG CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Ju Qinkun 10
#2 Wan Chuanyou 10
#3 Zhou Guozhong 9
#4 Shi Renlong 9
#5 Peng Fangmei 9
#6 Lv Yanxiang 7
#7 Lyu Yanxiang 3
#8 Lyu Zhaosong 1
#9 Chuanyou Wan 1
#10 Zhao Zhifen 1

Latest patents

Publication Filing date Title
CN105568126A Process for manufacturing brake calipers of vehicles
CN103219246A Manufacturing method of palladium-plated silver-plated double-plating bonding copper wire
CN103219245A Manufacturing method of palladium-plated bonding copper wire
CN103219248A Manufacturing method of gold-plated bonding copper wire
CN103219312A Palladium-plated gold-plated double-plating bonding copper wire
CN103219249A Manufacturing method of palladium-plated gold-plated double-plating bonding copper wire
CN103177942A Doping method for PMOS (p-channel metal oxide semiconductor) tube
CN103165537A Doping method of complementary metal-oxide-semiconductor transistor (CMOS) tube
CN103219311A Palladium-plated silver-plated double-plating bonding copper wire
CN103219247A Manufacturing method of silver-plated bonding copper wire
CN101954504A Machining fixture for automobile pressure plate