SOUEI TSUSHO KK has a total of 13 patent applications. Its first patent ever was published in 1991. It filed its patents most often in Japan. Its main competitors in its focus markets machines, machine tools and audio-visual technology are LEMI LTD, UAB ALTECHNA R&D and CORNING LASER TECH GMBH.
# | Country | Total Patents | |
---|---|---|---|
#1 | Japan | 13 |
# | Industry | |
---|---|---|
#1 | Machines | |
#2 | Machine tools | |
#3 | Audio-visual technology |
# | Technology | |
---|---|---|
#1 | Manufacturing processes | |
#2 | Soldering, welding and flame cutting | |
#3 | Working stone | |
#4 | Casings and printed circuits |
# | Name | Total Patents |
---|---|---|
#1 | Maekawa Shunichi | 11 |
#2 | Okiyama Toshihiro | 11 |
#3 | Shirahama Hideyuki | 10 |
#4 | Morita Hideki | 10 |
#5 | Oonita Eishin | 10 |
#6 | Suenaga Tomohiro | 6 |
#7 | Kinoshita Koichi | 5 |
#8 | Yokoyama Toshiyuki | 4 |
#9 | Mitsutake Katsuyuki | 3 |
#10 | Kajiwara Kunio | 3 |
Publication | Filing date | Title |
---|---|---|
JPH1163951A | External appearance inspection device | |
JPH1110375A | Cutting method | |
JPH1110376A | Cutting method | |
JPH1110374A | Cutting method | |
JPH1034363A | Brittle material splitting method by band shaped heat source | |
JPH1034364A | Brittle material splitting method by plural point heat sources | |
JPH091370A | Splitting method and its device | |
JPH08316157A | Heat treating furnace | |
JPH07328781A | Splitting method of brittle material | |
JPH07323382A | Cutting method | |
JPH07323385A | Method for cutting brittle material | |
JPH07323384A | Method for cutting brittle material | |
JPH0639572A | Wafer cutting device |