| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 8 | |
| #2 | China | 7 | |
| #3 | United States | 6 | |
| #4 | Republic of Korea | 4 | |
| #5 | Hong Kong | 3 | |
| #6 | Singapore | 3 | |
| #7 | Taiwan | 1 | |
| #8 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Machines | |
| #3 | Semiconductors | |
| #4 | Materials and metallurgy | |
| #5 | Surface technology and coating | |
| #6 | Micro-structure and nano-technology | |
| #7 | Audio-visual technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | S Abbas Hosseini | 16 |
| #2 | Hosseini S Abbas | 15 |
| #3 | Gilbert Albelo | 6 |
| #4 | Na Jung Un | 3 |
| #5 | Jung Un Na | 3 |
| #6 | Sa S Abbas Hosseini | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US2015136743A1 | Method of closed form release for brittle materials using burst ultrafast laser pulses | |
| US2015122656A1 | Mass based filtration devices and method of fabrication using bursts of ultrafast laser pulses | |
| US2015121960A1 | Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses | |
| US2015034613A1 | System for performing laser filamentation within transparent materials | |
| US2015034612A1 | Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses |