| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 6 | |
| #2 | EPO (European Patent Office) | 5 | |
| #3 | Republic of Korea | 5 | |
| #4 | United States | 3 | |
| #5 | Canada | 1 | |
| #6 | Japan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Machines | |
| #3 | Semiconductors | |
| #4 | Materials and metallurgy | |
| #5 | Surface technology and coating | |
| #6 | Micro-structure and nano-technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Hosseini S Abbas | 16 |
| #2 | S Abbas Hosseini | 5 |
| #3 | Herman Peter R | 1 |
| #4 | Mayerhofer Roland | 1 |
| #5 | Peter R Herman | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2016016257A1 | Method and apparatus for performing laser curved filamentation within transparent materials | |
| US2016318790A1 | Method and system for scribing heat processed transparent materials | |
| US2015140735A1 | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses | |
| EP2593266A2 | Method of material processing by laser filamentation |