| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 4 | |
| #2 | China | 2 | |
| #3 | WIPO (World Intellectual Property Organization) | 2 | |
| #4 | Australia | 1 | |
| #5 | EPO (European Patent Office) | 1 | |
| #6 | Japan | 1 | |
| #7 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Machine tools | |
| #3 | Optics | |
| #4 | Telecommunications |
| # | Technology | |
|---|---|---|
| #1 | Soldering, welding and flame cutting | |
| #2 | Manufacturing processes | |
| #3 | Unspecified technologies | |
| #4 | Optical systems | |
| #5 | Transmission | |
| #6 | Devices using light amplification |
| # | Name | Total Patents |
|---|---|---|
| #1 | Hoekstra Brian | 6 |
| #2 | Flannigan Roger | 5 |
| #3 | Wegerif David | 3 |
| #4 | Brian Hoekstra | 2 |
| #5 | Wegerif Daniel | 2 |
| #6 | Christensen Marc P | 1 |
| #7 | Haney Michael W | 1 |
| #8 | Hoekstra B | 1 |
| #9 | Milojkovic Predrag | 1 |
| #10 | Sato Kenji | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN1976778A | Device, system and method for cutting, cleaving or separating a substrate material | |
| JP2003131392A | Marking method and apparatus by laser beam | |
| AU1790001A | Method and apparatus for separating non-metallic materials | |
| US6326600B1 | Method and apparatus for distortion reduction in optoelectronic interconnections | |
| US4905249A | Catalytic converter |