| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 4 | |
| #2 | United States | 3 | |
| #3 | Australia | 1 | |
| #4 | Canada | 1 | |
| #5 | China | 1 | |
| #6 | Japan | 1 | |
| #7 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Chemical engineering | |
| #3 | Audio-visual technology | |
| #4 | Surface technology and coating | |
| #5 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Cleaning | |
| #3 | Special information storage | |
| #4 | Electrolytic coating production | |
| #5 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Itzkowitz Herman | 11 |
| #2 | Herman Itzkowitz | 1 |
| #3 | Taddei John | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN101384379A | Apparatus and method of chemical separation | |
| EP1829094A2 | Wet etching of the edge and bevel of a silicon wafer | |
| US2001032657A1 | Megasonic treatment apparatus | |
| EP1031647A2 | Apparatus and method for plating a wafer | |
| US5675856A | Wafer scrubbing device |