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SJ SEMICONDUCTOR CORP

Overview
  • Total Patents
    90
  • GoodIP Patent Rank
    15,933
  • Filing trend
    ⇧ 100.0%
About

SJ SEMICONDUCTOR CORP has a total of 90 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 2017. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, telecommunications and micro-structure and nano-technology are SJ SEMICONDUCTOR JIANGYIN CORP, INPAQ TECHNOLOGIES LTD and SMIC SEMICONDUCTOR JIANGYIN CO LTD.

Patent filings in countries

World map showing SJ SEMICONDUCTOR CORPs patent filings in countries
# Country Total Patents
#1 China 90

Patent filings per year

Chart showing SJ SEMICONDUCTOR CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lin Zhengzhong 86
#2 Chen Yanheng 68
#3 Wu Zhengda 50
#4 Lin Zhangshen 13
#5 Zhou Zuyuan 10
#6 Yin Jiashan 5
#7 Huang Han 5
#8 He Zhihong 5
#9 Lyu Jiao 5
#10 Chen Mingzhi 4

Latest patents

Publication Filing date Title
CN112289743A Wafer system level fan-out package structure and manufacturing method thereof
CN112289742A Wafer system level three-dimensional fan-out type packaging structure and manufacturing method thereof
CN111785647A Wafer-level chip packaging structure and preparation method thereof
CN111370385A Fan-out type system-in-package structure and manufacturing method thereof
CN111370387A Fan-out type system-in-package structure and manufacturing method thereof
CN111370386A Fan-out type system-in-package structure and manufacturing method thereof
CN111128772A Chip packaging method and chip packaging structure
CN111029263A Wafer level SIP module structure and preparation method thereof
CN111128919A Chip packaging method and chip packaging structure
CN111029268A Routing machine table
CN110926429A Light source identification equipment
CN110957284A Three-dimensional packaging structure of chip and packaging method thereof
CN110867385A Packaging structure and preparation method thereof
CN110828430A Packaging structure and preparation method thereof
CN110739251A material spreading structure, plastic packaging device and plastic packaging method
CN110718537A Semiconductor packaging structure and preparation method thereof
CN110610877A Device and method for reducing wafer warping degree and semiconductor equipment
CN112289688A Preparation method of rewiring layer
CN110349869A A kind of encapsulating structure and packaging method
CN110896036A Packaging structure and packaging method