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SIMEMS MICRO/NANO SYSTEM CO LTD

Overview
  • Total Patents
    15
  • GoodIP Patent Rank
    110,358
  • Filing trend
    ⇩ 66.0%
About

SIMEMS MICRO/NANO SYSTEM CO LTD has a total of 15 patent applications. It decreased the IP activity by 66.0%. Its first patent ever was published in 2015. It filed its patents most often in China. Its main competitors in its focus markets micro-structure and nano-technology, electrical machinery and energy and telecommunications are CAVENDISH KINETICS B V, CAVENDISH KINETICS INC and PARTRIDGE AARON.

Patent filings in countries

World map showing SIMEMS MICRO/NANO SYSTEM CO LTDs patent filings in countries
# Country Total Patents
#1 China 15

Patent filings per year

Chart showing SIMEMS MICRO/NANO SYSTEM CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Liu Zewen 15
#2 Gong Zhuhao 6
#3 Yang Zhongbao 4
#4 Xiao Qian 3
#5 Wang Jingxuan 3
#6 Chen Tao 3
#7 Mei Shanlin 3
#8 Yin Qing 2
#9 Li Linsong 2
#10 Zhang Yulong 2

Latest patents

Publication Filing date Title
CN110853924A RF MEMS digital variable capacitance unit
CN110853923A RF MEMS digital variable capacitor array structure
CN110112515A A kind of mixing phase shifter based on mems switch
CN110047662A A kind of high switching capacity ratio RF MEMS capacitive switch
CN109950063A Bistable state RF MEMS touch switch based on lever principle
CN108306081A A kind of high-power mems switch applied to RF application
CN108281328A A kind of RF MEMS Switches of high-performance high power capacity
CN107993857A Prepare the mobile micro-structure switch process of alloy material and its mobile micro-structure switch
CN108133869A Prepare the method and micro electro-mechanical system switch of high-performance radio-frequency micro electro-mechanical system switch
CN107814352A Wet etching packaging structure and its dicing method applied to RF MEMS
CN107814351A Suitable for the bonding packaging construction and its method of RF MEMS
CN106829849A RF mems switches encapsulating structure and its method for packing based on photosensitive BCB bondings
CN106927419A For the wafer-level package structure and its method for packing of radio-frequency micro electromechanical system
CN106115608A Laterally interconnection low-temperature round slice level packaging methods for the application of RF MEMS device
CN106145027A A kind of MEMS rotary actuator based on electrothermal drive