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SMIC CHANGDIAN SEMICONDUCTOR JIANGYIN CO LTD

Overview
  • Total Patents
    12
  • GoodIP Patent Rank
    138,623
  • Filing trend
    ⇩ 100.0%
About

SMIC CHANGDIAN SEMICONDUCTOR JIANGYIN CO LTD has a total of 12 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2015. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are KIM JU-YOUN, WAVESQUARE INC and ZHOU WANSHUN.

Patent filings in countries

World map showing SMIC CHANGDIAN SEMICONDUCTOR JIANGYIN CO LTDs patent filings in countries
# Country Total Patents
#1 China 12

Patent filings per year

Chart showing SMIC CHANGDIAN SEMICONDUCTOR JIANGYIN CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Lin Zhengzhong 11
#2 Chen Yanheng 6
#3 Wu Zhengda 4
#4 Lyu Jiao 3
#5 Qiu Yuedong 3
#6 Gu Wenxia 1
#7 Li Yanxun 1
#8 Cai Qifeng 1
#9 Luo Shikai 1
#10 Tang Hong 1

Latest patents

Publication Filing date Title
CN112054002A 3D chip packaging structure and preparation method thereof
CN112053966A CP (content provider) probe machine and adjusting method thereof
CN112053964A 3D chip packaging structure and preparation method thereof
CN112053996A 3D chip packaging structure and preparation method thereof
CN108010877A The encapsulating structure and method for packing of semiconductor chip
CN107644845A The encapsulating structure and method for packing of fingerprint recognition chip
CN107359144A System-level fan-out package structures of 3D and preparation method thereof
CN107248509A The chip-packaging structure and method for packing of EMI protection
CN105140213A Chip packaging structure and chip packaging method
CN105203175A Method for measuring volume of solder layer
CN105140191A Packaging structure and manufacturing method for redistribution leading wire layer
CN105070671A Chip encapsulation method