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NIPPON CIRCUIT KOGYO KK

Overview
  • Total Patents
    24
About

NIPPON CIRCUIT KOGYO KK has a total of 24 patent applications. Its first patent ever was published in 1998. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors are NANYA TECHNOLOGY INC, PARK HYUNG JO and SUZHOU KEYI SKY SEMICONDUCTOR TECHNOLOGIES INC.

Patent filings in countries

World map showing NIPPON CIRCUIT KOGYO KKs patent filings in countries
# Country Total Patents
#1 Japan 24

Patent filings per year

Chart showing NIPPON CIRCUIT KOGYO KKs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Yasui Hirobumi 19
#2 Sekine Yoshihiko 9
#3 Tanaka Akimasa 6
#4 Yamada Toru 6
#5 Sako Hideaki 5
#6 Shinoda Toshiaki 5
#7 Ikeda Yoshimasa 5
#8 Yoshioka Nariyasu 4
#9 Kamio Tadashi 3
#10 Mizufuji Jiro 3

Latest patents

Publication Filing date Title
JP2009135362A Manufacturing method of board for semiconductor package
JP2009099831A Method of manufacturing wiring board
JP2005228916A Printed wiring board for mounting semiconductor having through holes with biased center positions
JP2005012035A Printed circuit board for loading semiconductor of via-in-pad structure
JP2001237524A Method of manufacturing printed wiring board
JP2001237519A Method for manufacturing printed circuit board
JP2001237338A Flip chip ball grid array substrate and method of manufacturing the same
JP2001156216A Substrate for semiconductor package
JP2001135750A Method for manufacturing semiconductor package substrate
JP2001111214A Method of forming protective film
JP2001111215A Method of filling holes
JP2001110939A Semiconductor package substrate and manufacturing method thereof
JP2001110940A Semiconductor package substrate and manufacturing method thereof
JP2001111213A Method of filling holes
JP2001094018A Semiconductor package and production method thereof
JP2001024338A Forming method of through-hole of multilayer board
JP2001024310A Manufacture of printed board
JP2000323612A Flip chip ball grid array substrate and manufacture thereof
JP2000323611A Manufacture of ball grid array substrate
JP2000286529A Manufacture of printed circuit board