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SHENZHEN STS MICROELECTRONICS CO LTD

Overview
  • Total Patents
    51
  • GoodIP Patent Rank
    35,125
  • Filing trend
    ⇧ 700.0%
About

SHENZHEN STS MICROELECTRONICS CO LTD has a total of 51 patent applications. It increased the IP activity by 700.0%. Its first patent ever was published in 2005. It filed its patents most often in China and United States. Its main competitors in its focus markets semiconductors, measurement and machine tools are ASM TECH SINGAPORE PTE LTD, PAC TECH PACKAGING TECH GMBH and PAC TECH - PACKAGING TECH GMBH.

Patent filings in countries

World map showing SHENZHEN STS MICROELECTRONICS CO LTDs patent filings in countries
# Country Total Patents
#1 China 49
#2 United States 2

Patent filings per year

Chart showing SHENZHEN STS MICROELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wu Di 8
#2 Zhou Jie 7
#3 Huang Caiqing 5
#4 Wang Hong 5
#5 Du Junxing 5
#6 Gong Yu 5
#7 Zhang Zhen 5
#8 Zhan Sugeng 4
#9 Yu Bo 4
#10 Zhou Fuming 4

Latest patents

Publication Filing date Title
CN112230348A Full-automatic optical fiber coupling alignment device and optical fiber coupling alignment method
CN112255532A Chip failure positioning method and clamp
CN112206972A Automatic liquid feeding soaking device, plastic product production equipment and waste product treatment equipment
CN111252327A Automatic reel packaging production line and reel packaging method
CN111123077A Failure positioning method for chip
CN110954034A Method for measuring wire arc height of semiconductor device
CN110828432A Power semiconductor module
CN110806539A Detector for relay and driving chip
CN110751434A Material management method, device and system
CN110751435A Order dispatching method, device and system
CN110729211A Semiconductor packaging test intelligent factory
CN110739249A Monitoring method, device and system for semiconductor devices
CN110729203A Packaging process of open electrocardiogram sensor
CN110618004A Improved back unsealing method of semiconductor device
CN110634740A Improved back unsealing method of semiconductor device
CN110620051A Wafer surface coating method, packaging method and vacuum printing machine
CN110528042A A kind of semiconductor devices electro-plating method and the activated bath for plating
CN110544637A semiconductor device molding method and packaging mold used for same
CN110534460A A kind of modified patch device
CN109904077A The packaging method of multi-pipe pin semiconductor product