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ASM TECH SINGAPORE PTE LTD

Overview
  • Total Patents
    751
  • GoodIP Patent Rank
    3,967
  • Filing trend
    ⇩ 8.0%
About

ASM TECH SINGAPORE PTE LTD has a total of 751 patent applications. It decreased the IP activity by 8.0%. Its first patent ever was published in 1999. It filed its patents most often in United States, Singapore and China. Its main competitors in its focus markets semiconductors, machine tools and machines are JOYO MACHINE CO LTD, Tianjin jinlong welding material co ltd and KINGYOUP OPTRONICS CO LTD.

Patent filings per year

Chart showing ASM TECH SINGAPORE PTE LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kuah Teng Hock 80
#2 Ho Shu Chuen 74
#3 Song Keng Yew 73
#4 Kwan Ka Shing Kenny 59
#5 Cheng Chi Wah 54
#6 Wong Yam Mo 43
#7 Widdowson Gary Peter 38
#8 Zhang Yue 33
#9 Cheung Yu Sze 33
#10 Deng Jiangwen 32

Latest patents

Publication Filing date Title
US2020348243A1 Method for measuring the heights of wire interconnections
US2020309927A1 Apparatus and method for calibrating or testing an imaging device
US2020341056A1 Test handler having multiple testing sectors
US2021058536A1 Apparatus using reflective elements for aligning a lens module with an image sensor
US10748794B1 Apparatus for transferring electronic devices
US10861819B1 High-precision bond head positioning method and apparatus
US2021005498A1 Collet inspection in a semiconductor pick and place apparatus
US2020329181A1 Aligning an image sensor relative to a lens module
US10684118B1 Apparatus for determining an orientation of a die
US2020321211A1 Automated particle removal system
US2020316722A1 Optimised laser cutting
US2020316656A1 Air jet substrate cleaning apparatus
US2020286855A1 Formation of bonding wire vertical interconnects
US2020227281A1 Heating of a substrate for epoxy deposition
US2020203305A1 Die bonder incorporating rotatable adhesive dispenser head
US2020194270A1 Plasma chemical processing of wafer dies
US2020161193A1 Apparatus and method inspecting bonded semiconductor dice
US2020098614A1 Apparatus for packing ultra-small electronic devices
US2020098722A1 Y-theta table for semiconductor equipment
US2020047442A1 Apparatus and method for detecting failure in a mechanical press