| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 5 | |
| #2 | United States | 3 | |
| #3 | WIPO (World Intellectual Property Organization) | 3 | |
| #4 | Germany | 2 | |
| #5 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Semiconductors | |
| #3 | Measurement | |
| #4 | Audio-visual technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Azdasht Ghassem | 10 |
| #2 | Krause Thorsten | 5 |
| #3 | Geelhaar Ricardo | 3 |
| #4 | Lüdeke Heinrich | 2 |
| #5 | Zakel Elke | 1 |
| #6 | Teutsch Thorsten | 1 |
| Publication | Filing date | Title |
|---|---|---|
| DE102016100561A1 | Method for placing and contacting a test contact | |
| DE102015114129A1 | Device for removing a test contact of a test contact arrangement | |
| US2017165772A1 | Solder ball feeding device | |
| EP1869701A2 | Method and device for transferring a chip to a contact substrate |