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SHENGYI ELECTRONICS CO LTD

Overview
  • Total Patents
    206
  • GoodIP Patent Rank
    7,047
  • Filing trend
    ⇧ 64.0%
About

SHENGYI ELECTRONICS CO LTD has a total of 206 patent applications. It increased the IP activity by 64.0%. Its first patent ever was published in 2016. It filed its patents most often in China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets audio-visual technology, measurement and surface technology and coating are SHENZHEN SUNTAK MULTILAYER PCB, JIANGMEN SUNTAK CIRCUIT TECH CO LTD and JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO LTD.

Patent filings in countries

World map showing SHENGYI ELECTRONICS CO LTDs patent filings in countries

Patent filings per year

Chart showing SHENGYI ELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ji Chengguang 160
#2 Liu Mengru 85
#3 Wang Hongfu 76
#4 Chen Zhengqing 56
#5 Wang Xiaoping 48
#6 Xiao Lu 43
#7 Yuan Jiwang 40
#8 Jiao Qizheng 39
#9 Zhao Gangjun 28
#10 Li Minshan 27

Latest patents

Publication Filing date Title
CN112261802A Manufacturing method of embedded cavity and PCB
CN112105150A Manufacturing method of embedded cavity and PCB
CN112218428A Manufacturing method of embedded cavity and PCB
CN112261792A PCB manufacturing method for improving drilling burrs and PCB
CN112261791A Glue removing method for mixed-compression PCB
CN112218433A Mixed-compression PCB (printed circuit board) glue removing process
CN112087872A Glue removing process for mixed-compression PCB
CN112105160A Glue removing method for mixed-compression PCB
CN112198417A Via hole manufacturing capability test board and test method
CN112165772A Mixed-pressing PCB (printed Circuit Board) glue removing process
CN112188761A PCB processing method and PCB
CN112188738A Glue removing method for mixed-compression PCB
CN111867281A Manufacturing method of PCB with efficient heat dissipation
CN111918478A High-efficient radiating PCB
CN112030203A Through hole electroplating filling method and preparation method of printed circuit board
CN112030204A Through hole electroplating filling method and printed circuit board manufacturing method
CN111895775A Safety stop valve, hot air oven system, control method, device and medium
CN111901971A Circuit board and manufacturing method thereof
CN111787715A Method for manufacturing interconnection of inner layers of circuit board
CN111885819A Inner layer interconnection structure of circuit board