Learn more

SHENZHEN SUNTAK MULTILAYER PCB

Overview
  • Total Patents
    434
  • GoodIP Patent Rank
    4,151
  • Filing trend
    ⇧ 30.0%
About

SHENZHEN SUNTAK MULTILAYER PCB has a total of 434 patent applications. It increased the IP activity by 30.0%. Its first patent ever was published in 2008. It filed its patents most often in China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets audio-visual technology, measurement and machine tools are SHENGYI ELECTRONICS CO LTD, JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO LTD and JIANGMEN SUNTAK CIRCUIT TECH CO LTD.

Patent filings in countries

World map showing SHENZHEN SUNTAK MULTILAYER PCBs patent filings in countries

Patent filings per year

Chart showing SHENZHEN SUNTAK MULTILAYER PCBs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Peng Weihong 93
#2 Liu Dong 79
#3 Song Jianyuan 78
#4 Sun Baoyu 74
#5 Zhai Qingxia 56
#6 Zhou Wentao 45
#7 Zhu Tuo 44
#8 Wang Shuyi 41
#9 Jiang Xuefei 37
#10 Zhao Bo 34

Latest patents

Publication Filing date Title
CN112040657A Manufacturing method of special-shaped step plate
CN111901974A Manufacturing process of N + N blind pressing large back plate
CN112040634A Manufacturing process of embedded copper block circuit board
CN111901966A Communication PCB backboard and pressing and arranging method of buried copper plate
CN111970858A High-offset rigid-flex PCB and manufacturing method thereof
CN111741615A Method for pressing and filling glue of blind hole with high thickness-diameter ratio
CN111712067A Manufacturing method and conveying device for PCB pre-positioning continuous melt riveting
CN111575752A Electroplating manufacturing method for deep micro-hole in PCB
CN111315141A Method for manufacturing explosion-proof plate of thick plate and thick copper plate, thick plate and thick copper plate
CN111246676A Method for removing electric gold lead wire for preventing formation of secondary drilling burr
CN111163591A Method for manufacturing depth-control metallized micro-hole on circuit board
CN111050492A Electric golden finger method for reducing liquid medicine residue
CN110868808A Method for reducing dry film fragments generated in outer layer pattern manufacturing
CN110933875A Manufacturing method of copper-embedded PCB
CN110708873A Manufacturing method for realizing positioning of embedded copper block
CN110708859A Embedded copper block and manufacturing method for enhancing bonding force of embedded copper block
CN110446350A A method of making filling holes with resin on PCB
CN110561546A Calibration jig and calibration method for calibrating height of cutter feeder and height of cutter head seat
CN110312361A A kind of production method in the device resistance hole that can set impedance value in a big way
CN110248473A A method of it is small to solve VIA-IN-PAD filling holes with resin PCB printed board crimping hole