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JIANGMEN SUNTAK CIRCUIT TECH CO LTD

Overview
  • Total Patents
    164
  • GoodIP Patent Rank
    8,836
  • Filing trend
    ⇩ 12.0%
About

JIANGMEN SUNTAK CIRCUIT TECH CO LTD has a total of 164 patent applications. It decreased the IP activity by 12.0%. Its first patent ever was published in 2014. It filed its patents most often in China. Its main competitors in its focus markets audio-visual technology, surface technology and coating and measurement are SHENZHEN SUNTAK MULTILAYER PCB, JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO LTD and SHENGYI ELECTRONICS CO LTD.

Patent filings in countries

World map showing JIANGMEN SUNTAK CIRCUIT TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 164

Patent filings per year

Chart showing JIANGMEN SUNTAK CIRCUIT TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Xun Ruiping 62
#2 Xu Wenzhong 33
#3 Wang Guangming 30
#4 Zhang Huayong 26
#5 Zhong Yuling 25
#6 Zhang Yibing 24
#7 Ao Sichao 22
#8 Li Jiang 22
#9 Huang Li 21
#10 Dai Yong 20

Latest patents

Publication Filing date Title
CN112261787A Drilling method for large-size printed board
CN112261788A Manufacturing method of thick copper high-density interconnection printed board
CN112203441A Device and method for preventing PCB hole from being copper-free by rapidly detecting copper deposition vibration
CN112272454A Method for preventing PCB (printed circuit board) from laminating, fusing and glue flowing
CN111977372A Board suction arm of PCB universal testing machine and method for rapidly switching boards
CN112105156A PCB carrier vehicle and method for improving production efficiency of forming process
CN111867266A Circuit design method for preventing short circuit of isolated circuit of PCB
CN111970857A Method for improving poor hole plugging of PCB resin
CN111770636A Circuit board character baking method capable of saving electric energy
CN111800951A Method for manufacturing circuit of printed circuit board
CN111683458A Back drilling method for small hole with high thickness-diameter ratio in circuit board
CN111669905A Core board, manufacturing method thereof and method for preventing bent board of laminated board from warping
CN111683457A Manufacturing method of rigid-flex board
CN111586975A Laminating method and laminating row board structure of PCB (printed circuit board)
CN111315157A Method for quantifying slice hole offset
CN111200910A Method for manufacturing small-aperture back drilled hole
CN111107715A Manufacturing method of HDI plate back drilling hole
CN111182743A Manufacturing method of ceramic-based circuit board
CN111050484A Manufacturing method of ultra-precise circuit
CN111148376A Laminating method of thick dielectric layer PCB