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HUIZHOU CHINA EAGLE ELECT TECH CO LTD

Overview
  • Total Patents
    78
  • GoodIP Patent Rank
    18,595
  • Filing trend
    ⇧ 30.0%
About

HUIZHOU CHINA EAGLE ELECT TECH CO LTD has a total of 78 patent applications. It increased the IP activity by 30.0%. Its first patent ever was published in 2015. It filed its patents most often in China. Its main competitors in its focus markets audio-visual technology, measurement and optics are JIANGMEN SUNTAK CIRCUIT TECHNOLOGY CO LTD, SHENZHEN SUNTAK MULTILAYER PCB and JIANGMEN SUNTAK CIRCUIT TECH CO LTD.

Patent filings in countries

World map showing HUIZHOU CHINA EAGLE ELECT TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 78

Patent filings per year

Chart showing HUIZHOU CHINA EAGLE ELECT TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Li Xiaohai 24
#2 Liu Dewei 20
#3 Qiu Chengwei 18
#4 Huang Shengrong 17
#5 Ye Hanxiong 16
#6 Yu Xiaofeng 13
#7 Zeng Xianxi 13
#8 Gao Ping'An 11
#9 Wang Xiaobin 11
#10 Hu Yuchun 10

Latest patents

Publication Filing date Title
CN112291932A Method for improving utilization rate of electric wood board for PCB drilling processing
CN112203425A Manufacturing method of high-rise blind buried hole thick copper plate
CN112203424A PCB (printed circuit board) alignment special blind hole inspection mode
CN112272452A Preparation method for reducing upper-width distance of PAD (PAD-on-PAD) of flip LED (light-emitting diode) board
CN112188737A Machining process for improving influence of back drilling hole on signal transmission of high-speed PCB
CN112188760A Local mixed-compression method for high-speed printed circuit board
CN112203442A Manufacturing method of high-frequency mixed-compression printed circuit board for bullet train sensor
CN112218421A Line inspection alignment method based on automatic vision
CN112218430A Manufacturing method of copper block-embedded circuit board of new energy automobile
CN111867277A Manufacturing method of copper block-embedded power panel
CN111885838A Method for improving orifice burrs of mechanically drilled rigid-flex board with height difference on board surface
CN111988914A Manufacturing method of new energy automobile power supply core board
CN111970829A Application of via filling in thermal management of 5G optical module
CN111954394A Manufacturing method of 5G high-speed backboard ladder gold finger
CN111941069A Method for manufacturing 5G communication three-dimensional FPC antenna
CN111970830A Processing method of high-frequency microwave circuit board using PTFE material
CN111970828A 5G optical module Wire bonding pad integrity etching design method
CN111405780A Manufacturing method of high-speed plate high-layer thick copper mixed pressing plate
CN111341766A Method for manufacturing mini LED mainboard
CN111315148A Rework method for gold plating plate or gold plating plate lead metal infiltration short circuit