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SEZ AG

Overview
  • Total Patents
    130
About

SEZ AG has a total of 130 patent applications. Its first patent ever was published in 1997. It filed its patents most often in EPO (European Patent Office), WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets semiconductors, machines and chemical engineering are BRASK JUSTIN K, INTELLIGENT SOURCES DEV CORP and TRU SI TECHNOLOGIES INC.

Patent filings per year

Chart showing SEZ AGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Obweger Rainer 11
#2 Pfeuffer Alexander 11
#3 Lippert Alexander 9
#4 Hohenwarter Karl-Heinz 8
#5 Sellmer Reinhard 8
#6 Kraus Harald 8
#7 Ferrell Gary W 8
#8 Putzi Christian 6
#9 Sax Harry 5
#10 Claes Martine 5

Latest patents

Publication Filing date Title
CN101542684A Device and method for removing liquid from surface of disc-like article
WO2007128659A1 Device and method for wet treating plate-like substrates
TW200625426A Apparatus and method for drying disk-shaped substrates
TW200625438A Method for selective etching
TW200603895A Fluid discharging device
TW200536012A Method for selective etching
EP1648024A1 Method for removing particles from a surface
WO2004114372A1 Device and method for wet treating disc-like substrates
WO2004110657A2 Uniform cavitation for particle removal
WO2004036620A2 Method for generating oxide layers on semiconductor substrates
TW200416188A Device and method for transporting wafer-shaped articles
AT500984A1 Device for liquid treatment of disk objects
ATA3482002A Method for wet treating disc-shaped objects
ATA15182001A Ringtoned recording device for a rotating support for receiving a disconnected object such as a semiconductor wafer
US2002002991A1 Device for treating a disc-shaped object
EP1202326A1 Apparatus for liquid treatment of wafers-like objects
EP1214739A2 Copper deposit process
SG118063A1 A device for an etch treatment of a disk-like object
EP0886305A2 Method and apparatus for handling disc substrates, e.g. silicon wafers
ATA165897A METHOD FOR planarizing semiconductor SUBSTRATES