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SEMES CO LTD

Overview
  • Total Patents
    7,351
  • GoodIP Patent Rank
    479
  • Filing trend
    ⇧ 36.0%
About

SEMES CO LTD has a total of 7,351 patent applications. It increased the IP activity by 36.0%. Its first patent ever was published in 2003. It filed its patents most often in Republic of Korea, China and United States. Its main competitors in its focus markets semiconductors, optics and electrical machinery and energy are MUJIN ELECTRONICS CO LTD, HUAHONG SEMICONDUCTOR WUXI CO LTD and WOO BUM JE.

Patent filings in countries

World map showing SEMES CO LTDs patent filings in countries

Patent filings per year

Chart showing SEMES CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kim Hyung Joon 167
#2 Koo Kyo Woog 116
#3 Choi Ki Hoon 89
#4 Park Gui Su 89
#5 Kwon Oh Jin 85
#6 Song Gil Hun 84
#7 Kim Dae Sung 83
#8 Kim Boong 80
#9 Cho Jung Keun 75
#10 Lee Young Hun 74

Latest patents

Publication Filing date Title
KR20210030917A Substrate treating apparatus and substrate treating method
KR20210029755A Apparatus for treating substrate, and nozzle cleaning method
KR20210024514A Transporting apparatus for manufacturing semiconductor device, and system for transporting semiconductor device with the apparatus
KR20210021332A Apparatus for treating a substrate and an Method for treating a substrate
KR20210021330A Apparatus for Processing Substrate
KR20210014720A Apparatus and method for treating substrate
KR20210013256A Apparatus and Method for treating substrate
KR20210008891A Apparatus and method for treating substrate
KR20210008134A Transferring Apparatus and Transferring Method for Fabricating Integrated circuit
KR20210008549A Buffer unit, Apparatus and Method for treating substrate with the unit
KR20210006875A Apparatus for treating substrate
KR20210002427A Unit for supporting cassette and vehicle having the unit
KR20200143663A Temperature control apparatus and temperature control method
KR20200141969A Purge apparatus and purge method
KR20200135268A Module for aligning bonding tool and die bonding apparatus having the same
KR20210003696A Semiconductor package test apparatus
KR20200135259A Apparatus for controlling temperature of substrate, apparatus for treating substrate including the same and method for treating substrate
KR20200132827A Method for cooling hot plate, Apparatus and Method for treating substrate
KR20200127141A Supercritical processing aparatus
US2021125854A1 Substrate processing apparatus