Learn more

QUANTUM MATERIALS INC

Overview
  • Total Patents
    48
About

QUANTUM MATERIALS INC has a total of 48 patent applications. Its first patent ever was published in 1986. It filed its patents most often in United States, Australia and EPO (European Patent Office). Its main competitors in its focus markets macromolecular chemistry and polymers, basic materials chemistry and audio-visual technology are SHOWA DENKO MATERIALS CO LTD, HITACHI CHEMICAL CO LTD JP and SONY CHEMICAL & INF DEVICE.

Patent filings per year

Chart showing QUANTUM MATERIALS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Dershem Stephen M 28
#2 Patterson Dennis B 10
#3 Derfelt Deborah L 8
#4 Forray Deborah D 8
#5 Forray Deborah Derfelt 4
#6 Husson Frank D Jr 3
#7 Osuna Jr Jose A 3
#8 Neff Benjamin 3
#9 Osuna Jose A Jr 3
#10 Tay Swee-Teck 2

Latest patents

Publication Filing date Title
CN1245520A Reducing void formation in curable adhesive formulations
US5714086A Propargyl ether-containing compositions useful for underfill applications
US5717034A Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor
US5663109A Low temperature glass paste with high metal to glass ratio
US5753748A Bleed resistant cyanate ester-containing compositions
CA2198745A1 Thermosetting resin compositions containing maleimide and/or vinyl compounds
TW332211B Thermosetting resin compositions containing maleimide and/or vinyl compounds
US5646241A Bleed resistant cyanate ester-containing compositions
AU6441794A Die-attach compositions
US5336357A Manually operable die attach apparatus
US5358992A Die-attach composition comprising polycyanate ester monomer
US5489641A Freeze resistant die-attach compositions
US5306333A Resinless pseudoplastic bonding compositions
US5313841A Die adhesion testing method and apparatus
US5232962A Adhesive bonding composition with bond line limiting spacer system
US5045127A Non-ionic, water washable soldering paste
US5064480A Water washable soldering paste
US4968738A Silver-glass die attach paste with reduced resin
US4761224A Silver-glass paste with poly-modal flake size distribution and quick dry vehicle
US4636254A Silver-glass paste for attachment of silicon die to ceramic substrate