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HENKEL LOCTITE CORP

Overview
  • Total Patents
    164
About

HENKEL LOCTITE CORP has a total of 164 patent applications. Its first patent ever was published in 1995. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets macromolecular chemistry and polymers, machines and semiconductors are ASANO MASATOSHI, SONY CHEMICAL & INF DEVICE and HITACHI CHEMICAL CO LTD.

Patent filings per year

Chart showing HENKEL LOCTITE CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Attarwala Shabbir 14
#2 Konarski Mark M 12
#3 Liu Puwei 9
#4 Dershem Stephen M 8
#5 Newberth Frederick F Iii 8
#6 Gallo Anthony A 8
#7 Wojciak Stan 7
#8 Yaeger Erin K 7
#9 Bennington Lester D 6
#10 Burdzy Matthew P 5

Latest patents

Publication Filing date Title
AU2003270464A1 High-gloss room temperature curable water-based mold release agent
US2005042961A1 Curable compositions for advanced processes, and products made therefrom
WO03107427A1 Interlayer dielectric and pre-applied die attach adhesive materials
US2004225045A1 Highly conductive resin compositions
AU2003213239A1 Light-curing device and process for producing hearing aid shells using light-curable resins
US2004166241A1 Molding compositions containing quaternary organophosphonium salts
JP2004204146A Silicone resin composition
AU2002366088A1 Anaerobic adhesive compositions curable on inactive surfaces
AU2002352759A1 Housing for curing a work piece
AU2002359417A1 Anaerobic adhesive compositions curable on inactive surfaces
AU2002357674A1 Luminescing and/or fluorescing radiation-curable, cyanoacrylate-containing compositions
WO03035703A1 Non-flammable and non-combustible adhesive bonding systems having adherence to low energy surfaces
WO03028070A2 Compositions having controlled flowability and thermal properties
AU2002331039A1 Continuous path, variable width light attenuation device for electromagnetic energy spot cure system
WO03016394A1 Composition of bulk filler and epoxy-clay nanocomposite
JP2004027159A Thermosetting liquid resin composition
TWI227257B Flame retardant molding compositions
US2002190481A1 Material for sealing threaded pipe joints, and dispenser therefor
JP2003327785A Cationically photocurable epoxy resin composition
WO02090453A2 Anaerobic sealant compositions having enhanced washability