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SAEHAN MICRONICS INC

Overview
  • Total Patents
    24
About

SAEHAN MICRONICS INC has a total of 24 patent applications. Its first patent ever was published in 2000. It filed its patents most often in Republic of Korea, Japan and Taiwan. Its main competitors in its focus markets macromolecular chemistry and polymers, semiconductors and basic materials chemistry are FSK KK, ANSHENG TECH GUANGDONG CO LTD and NITTO DENKO CORP JP.

Patent filings in countries

World map showing SAEHAN MICRONICS INCs patent filings in countries
# Country Total Patents
#1 Republic of Korea 8
#2 Japan 7
#3 Taiwan 4
#4 Singapore 2
#5 China 1
#6 Germany 1
#7 United States 1

Patent filings per year

Chart showing SAEHAN MICRONICS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Gyeong Rok 10
#2 Kwon Jeong Min 9
#3 Chang Kyeong Ho 7
#4 Jang Gyeong Ho 6
#5 Kim Koan Mu 5
#6 Zan Kyon Ho 4
#7 Kweon Jeong Min 4
#8 Kweon Jeong-Min 3
#9 Lee Kyung-Rok 3
#10 Kim Sun Sik 3

Latest patents

Publication Filing date Title
JP2006114864A Two-sided tape for loc and manufacturing method therefor
KR100444925B1 Thermoset adhesive composition and adhesive tape for electronic application using it
KR20020079703A Heat resistant adhesive and adhesive tape for semiconductors
KR20020079696A Composite film and lead frame adhering this film
JP2003318354A Composite film and lead frame attached with the same
JP2003321655A Composite film and lead frame attached with the same
SG109497A1 Composite film and lead frame with composite film attached
SG109496A1 Composite film and lead frame with composite film attached
KR20030072885A Composite film and lead frame adhering this film
KR20030072884A Composite film and lead frame adhering this film
US6452282B1 Insulating adhesive tape for a semiconductor chip package having a copper lead frame
KR20020078839A Insulating adhesive tape for semiconductor chip package having copper lead frame
KR20020065723A Adhesive for electronic parts and adhesive tape using the same
KR20020065722A Polyimide high temperature adhesive and adhesive tape using the same
TW508360B Method for the preparation of polyamic acid and polyimide useful for adhesives
TW526222B Polyimide for high temperature adhesive
TWI254058B Method for the preparation of polyamic acid and polyimide
DE10008121A1 Process for the preparation of polyamic acid and polyimide and adhesive or adhesive consisting of the polyamic acid or polyimide thus prepared