POLY FLEX CIRCUITS INC has a total of 14 patent applications. Its first patent ever was published in 1989. It filed its patents most often in EPO (European Patent Office), United States and Australia. Its main competitors in its focus markets electrical machinery and energy, audio-visual technology and basic materials chemistry are TESSERA INTERCONNECT MATERIALS, ZHEN DING TECHNOLOGY CO LTD and MEIKO ELECTRONICS CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | EPO (European Patent Office) | 5 | |
#2 | United States | 5 | |
#3 | Australia | 1 | |
#4 | Canada | 1 | |
#5 | Japan | 1 | |
#6 | WIPO (World Intellectual Property Organization) | 1 |
# | Name | Total Patents |
---|---|---|
#1 | Durand David | 13 |
#2 | Chu Ang-Ling | 8 |
#3 | Vieau David P | 8 |
#4 | Wei Tai Shing | 5 |
#5 | Iannetta Jr Roger A | 3 |
#6 | Wei Tai S | 2 |
#7 | Deebuitsudo Deyurando | 1 |
#8 | Tai Shin Uei | 1 |
#9 | Deebuitsudo Pii Buiyuu | 1 |
#10 | Annrin Chiyuu | 1 |
Publication | Filing date | Title |
---|---|---|
EP0641019A2 | A flexible printed polymer lead-frame. | |
US5531020A | Method of making subsurface electronic circuits | |
JPH07207239A | Moisture-resistant conductive cement, its production, and method of using it | |
EP1246206A2 | Moisture resistant electrically conductive cements and method for the production and using same | |
US5183593A | Electrically conductive cement | |
US5180523A | Electrically conductive cement containing agglomerate, flake and powder metal fillers |