| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 8 | |
| #2 | United States | 6 | |
| #3 | Japan | 3 | |
| #4 | China | 1 | |
| #5 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Electrical machinery and energy | |
| #2 | Semiconductors | |
| #3 | Machines | |
| #4 | Surface technology and coating | |
| #5 | Measurement | |
| #6 | Chemical engineering |
| # | Name | Total Patents |
|---|---|---|
| #1 | Westerman Russell | 16 |
| #2 | Martinez Linnell | 13 |
| #3 | Pays-Volard David | 12 |
| #4 | Johnson Chris | 11 |
| #5 | Johnson David | 10 |
| #6 | Grivna Gordon M | 8 |
| #7 | Grivna Gordon | 4 |
| #8 | Gordon Grivna | 3 |
| #9 | Chris Johnson | 3 |
| #10 | Lazerand Thierry | 3 |
| Publication | Filing date | Title |
|---|---|---|
| US9865436B1 | Powered anode for ion source for DLC and reactive processes | |
| USRE46339E | Method and apparatus for plasma dicing a semi-conductor wafer | |
| TW201415520A | System for the processing of an object by plasma, selective plasma processing process of a composite object, and etched composite object obtained by the same process |