| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 9 | |
| #2 | WIPO (World Intellectual Property Organization) | 3 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Electrical machinery and energy | |
| #3 | Chemical engineering | |
| #4 | Measurement | |
| #5 | Machines | |
| #6 | Surface technology and coating | |
| #7 | Packaging and shipping |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Electric discharge tubes | |
| #3 | Cleaning | |
| #4 | Measuring length, angles and areas | |
| #5 | Metallic material cleaning | |
| #6 | Unspecified technologies | |
| #7 | Unspecified technologies | |
| #8 | Manipulators | |
| #9 | Plasma technique |
| # | Name | Total Patents |
|---|---|---|
| #1 | Bailey Iii Andrew D | 12 |
| #2 | Kim Yunsang | 6 |
| #3 | Kennedy William S | 2 |
| #4 | Schoepp Alan M | 2 |
| #5 | Sexton Gregory | 2 |
| #6 | Cain Stephen J | 1 |
| #7 | Lohokare Shrikant P | 1 |
| #8 | Chen Jack | 1 |
| #9 | Sirard Stephen M | 1 |
| #10 | Takeshita Kenji | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2010213173A1 | Bevel plasma treatment to enhance wet edge clean | |
| US2009084169A1 | Wafer bow metrology arrangements and methods thereof | |
| US2008311758A1 | Methods of and apparatus for protecting a region of process exclusion adjacent to a region of process performance in a process chamber | |
| US2008179010A1 | Bevel etcher with vacuum chuck |