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NITTETSU MICRO METAL KK

Overview
  • Total Patents
    28
About

NITTETSU MICRO METAL KK has a total of 28 patent applications. Its first patent ever was published in 1987. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, packaging and shipping and audio-visual technology are VISWANATHAN LAKSHMINARAYAN, ORIENT SEMICONDUCTOR ELECT LTD and SILICON BASE DEV INC.

Patent filings in countries

World map showing NITTETSU MICRO METAL KKs patent filings in countries
# Country Total Patents
#1 Japan 28

Patent filings per year

Chart showing NITTETSU MICRO METAL KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hayashi Nobumitsu 11
#2 Yamada Takashi 6
#3 Komori Kiyotsugu 6
#4 Ujita Junichi 6
#5 Ueda Takayuki 5
#6 Nishibayashi Kagekimi 3
#7 Kita Tatsuhiko 2
#8 Nishimura Hiroshi 2
#9 Taneda Hideo 1
#10 Nishibayashi Kagehito 1

Latest patents

Publication Filing date Title
JP2012109356A Bonding wire and method for manufacturing the same
JP2010106321A Apparatus and method of producing fine particle
JP2006255784A Unleaded solder alloy
JP2005191055A Apparatus and method of wire bonding for extrafine wire
JP2005048212A Heat treatment furnace for gold bonding wire
JP2004087545A Spool for gold bonding wire
JP2003136126A Method and apparatus for wiredrawing metallic thin line
JP2003055748A Method and device for heat treatment of gold bonding wire
JP2003053418A Method and device for drawing extra fine gold wire
JP2003048052A Method and device for manufacturing ingot for wire drawing
JP2003048013A Method for manufacturing gold bonding wire
JP2002057184A Spool holder for bonding wire
JP2002282929A Method and device for wire drawing of metal thin wire by slip wiring roll
JP2002205111A Method and apparatus for drawing wire with slip type wire-drawing mill
JP2002026060A Spool for bonding wire
JP2001247907A Manufacturing method and manufacturing apparatus of spherical metal particle
JP2001210670A Spool case of semiconductor bonding wire
JP2001093930A Spool case for semiconductor bonding wire
JP2001068494A Method and device for arranging metal balls
JP2001068839A Method and device for metal sphere layout