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NINGBO CHIPEX SEMICONDUCTOR CO LTD

Overview
  • Total Patents
    34
  • GoodIP Patent Rank
    54,078
  • Filing trend
    ⇩ 60.0%
About

NINGBO CHIPEX SEMICONDUCTOR CO LTD has a total of 34 patent applications. It decreased the IP activity by 60.0%. Its first patent ever was published in 2013. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, surface technology and coating and optics are WUHU QIDI SEMICONDUCTOR CO LTD, NAT CT FOR ADVANCED PACKAGING NCAP CHINA and SEMICONDUCTOR MFG INT CORP (BEIJING).

Patent filings in countries

World map showing NINGBO CHIPEX SEMICONDUCTOR CO LTDs patent filings in countries
# Country Total Patents
#1 China 34

Patent filings per year

Chart showing NINGBO CHIPEX SEMICONDUCTOR CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Fang Lianghong 24
#2 Luo Lihui 18
#3 Ren Chao 16
#4 Peng Yi 15
#5 Li Chunyang 13
#6 Liu Mingming 12
#7 Liu Feng 10
#8 Wu Chao 8
#9 Yu Zheng 7
#10 Zhong Zhiming 6

Latest patents

Publication Filing date Title
CN111900078A Method for thinning lithium niobate wafer
CN111725104A Method, device and equipment for braiding wafer
CN111755342A Method for packaging wafer-level chip
CN111883448A Back grinding optimization method and device applied to small chip
CN111799245A Chip identification method and chip with identification
CN111755343A Warpage-preventing non-silicon-based wafer-level chip packaging method
CN111710613A Wafer-level chip packaging method
CN111883449A Method for improving height uniformity of electroplated bump
CN110221632A A kind of curing oven Nitrogen Control Units and method
CN110320760A It is a kind of that the identifiable exposure method of Wafer ID is guaranteed by multiple exposure
CN110335825A A kind of wafer stage chip encapsulation method
CN110299330A A kind of encapsulating structure and packaging method of wafer stage chip
CN110233115A A kind of wafer stage chip encapsulation method and encapsulating structure
CN110335828A A kind of chip packaging method and encapsulating structure increasing redistributing layer binding force
CN110335826A A kind of packaging method of the wafer stage chip with bonding structure
CN110323176A A kind of three-dimension packaging method and encapsulating structure of chip
CN110310898A A kind of test chip mark method and chip yield method for improving
CN109037145A A kind of TSV through hole and its sputtering technology
CN108933103A A kind of super-small chip cutting technique
CN107895698A A kind of thick method for packing of 15 μm of copper