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SEMICONDUCTOR MFG INT BEIJING

Overview
  • Total Patents
    453
  • GoodIP Patent Rank
    36,240
About

SEMICONDUCTOR MFG INT BEIJING has a total of 453 patent applications. Its first patent ever was published in 2008. It filed its patents most often in China and United States. Its main competitors in its focus markets semiconductors, computer technology and optics are TAIWAN SEMICONDUCTOR MFG CO LTD, UNITED MICROELECTRONICS CORP and TAIWAN SEMICONDUCTOR MFG.

Patent filings in countries

World map showing SEMICONDUCTOR MFG INT BEIJINGs patent filings in countries
# Country Total Patents
#1 China 421
#2 United States 32

Patent filings per year

Chart showing SEMICONDUCTOR MFG INT BEIJINGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Haiyang Zhang 27
#2 Wu Sun 23
#3 Mieno Fumitake 17
#4 Xinpeng Wang 17
#5 Qiuhua Han 16
#6 Manhua Shen 14
#7 Hong Zhongshan 14
#8 Haihua Chen 14
#9 He Yonggen 13
#10 Zhang Haiyang 12

Latest patents

Publication Filing date Title
US9256703B1 Method of detecting a scattering bar by simulation
CN105336562A Heat treatment cavity, heat treatment method and coating equipment
CN105336667A Manufacturing method of semiconductor device
CN105336587A Semiconductor device and manufacturing method thereof
CN105336661A Formation method of semiconductor structure
CN105140172A Interconnection structure and formation method thereof
CN105097583A Semiconductor structure failure analysis method
CN105097048A Flash setting method used for HTOL (High Temperature Operating Life) test
CN105092898A Semiconductor detection structure, forming method and detection method
CN105092995A Detection method and device of quiescent current failure device in chip
CN105097513A Semiconductor device, manufacture method thereof and electronic device
CN105097793A Integrated circuit and design method thereof
CN104949776A MEMS pressure sensor and manufacturing method
CN104944361A Manufacturing method of MEMS device
CN104934396A Manufacturing method of bonding structure
CN104909331A Wafer selective-bonding method
CN104835738A Method of forming fins of FinFET device
CN104742007A Chemical mechanical grinding device and chemical mechanical grinding method
CN104750234A Wearable intelligent device and interacting method for wearable intelligent device
CN104733374A Metal interconnecting structure and forming method thereof