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NICHIDEN SEIMITSU KOGYO KK

Overview
  • Total Patents
    18
About

NICHIDEN SEIMITSU KOGYO KK has a total of 18 patent applications. Its first patent ever was published in 1992. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors are NASU HAYATO, SHENZHEN FANGDA GUOKE OPTOELEC and ESTIVATION PROPERTIES LLC.

Patent filings in countries

World map showing NICHIDEN SEIMITSU KOGYO KKs patent filings in countries
# Country Total Patents
#1 Japan 18

Patent filings per year

Chart showing NICHIDEN SEIMITSU KOGYO KKs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Tanaka Shinichi 5
#2 Ishihara Takao 3
#3 Ogura Mikio 2
#4 Yoshida Taketora 1
#5 Hotta Saneo 1
#6 Ito Kiyotaka 1
#7 Nagura Yukihiko 1
#8 Kato Kenji 1
#9 Kawai Teruo 1
#10 Yamada Kazuo 1

Latest patents

Publication Filing date Title
JP2010161098A Method of manufacturing lead frame, lead frame, method of manufacturing heat sink, and heat sink
JP2007171868A Frame of thin display
JP2007013062A Lead frame, its manufacturing method and semiconductor package using same
JP2006332241A Lead frame and manufacturing method thereof
JP2006147622A Lead frame and method of manufacturing the same
JP2005228812A Lead frame and method for manufacturing the same
JP2005186116A Die for shearing, shearing method, method for manufacturing edge member, edge member and reciprocating type machine
JP2005186115A Pressing method, press die, blade member manufacturing method, blade member, and reciprocating equipment
JP2005109029A Lead frame and its manufacturing method
JP2005093829A Led, lead frame for led, and method and apparatus for manufacturing lead frame for led
JP2005057162A Method for manufacturing lead frame and manufacturing apparatus
JP2005032876A Lead frame
JP2004363195A Semiconductor device, and lead frame used therefor
JP2004363194A Semiconductor device, lead frame used therefor, and its manufacturing method
JP2003197841A Lead frame for loc and manufacturing method therefor
JP2000299417A Metallic heat sink for semiconductor device and its manufacture
JP2000294716A Lead frame
JPH05291454A Manufacture of lead frame