| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 2 | |
| #2 | Australia | 1 | |
| #3 | Canada | 1 | |
| #4 | China | 1 | |
| #5 | EPO (European Patent Office) | 1 | |
| #6 | Republic of Korea | 1 | |
| #7 | Morocco | 1 | |
| #8 | Malaysia | 1 | |
| #9 | Philippines | 1 | |
| #10 | Ukraine | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Computer technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Data recognition and presentation |
| # | Name | Total Patents |
|---|---|---|
| #1 | Ng Eng Seng | 11 |
| #2 | Pang Sze Yong | 10 |
| Publication | Filing date | Title |
|---|---|---|
| EP3384434A1 | Method for embedding integrated circuit flip chip | |
| WO2014182239A1 | Ultra-thin smart card modules with chip bumps disposed in susbtrate via holes and methods of fabricating the same | |
| MY163772A | An improved trailing unit and its method of assembly. |