DYNACARD CO LTD has a total of 15 patent applications. Its first patent ever was published in 2003. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets semiconductors, computer technology and electrical machinery and energy are TRON INTELLIGENCE INC, PLETTNER ANDREAS and MICROARRAY CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 8 | |
#2 | United States | 3 | |
#3 | China | 2 | |
#4 | Japan | 1 | |
#5 | Republic of Korea | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Computer technology | |
#3 | Electrical machinery and energy |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Data recognition and presentation | |
#3 | Lighting device details | |
#4 | Non-portable lighting devices |
# | Name | Total Patents |
---|---|---|
#1 | Tsai Pai Ching | 5 |
#2 | Hwang Nian-Horng | 4 |
#3 | Shie Tzung-Hau | 3 |
#4 | Li Hung Yun | 2 |
#5 | Ko Tsung-Ming | 1 |
#6 | Hsieh Chung-Hao | 1 |
#7 | Congming Ke | 1 |
#8 | Lin Hung-Sheng | 1 |
#9 | Xie Zong-Hao | 1 |
#10 | Ke Cong-Ming | 1 |
Publication | Filing date | Title |
---|---|---|
TW201546913A | Manufacturing method for packaging module of fingerprint identification chip | |
TWI485821B | Package module of fingerprint identification chip and method of the same | |
TW201533380A | Light emitting diode light source with fluorescent powder | |
CN102244040A | Double-substrate type storage card capsulation method and construction thereof | |
TW201241968A | Dual-substrate - memory card package method and structure thereof | |
US2010176204A1 | Ic chip | |
US2010078485A1 | Subscriber identity module card | |
TW200713073A | Smart card, electronic module of smart card, and manufacturing method thereof | |
TW200604952A | Test method of multi-chip smart card | |
TW200516592A | Memory card with USB control chip | |
TW592022B | Forming method of electronic recording medium and structure thereof |