MICROARRAY MICROELECTRONICS CORP LTD has a total of 27 patent applications. It increased the IP activity by 350.0%. Its first patent ever was published in 2015. It filed its patents most often in WIPO (World Intellectual Property Organization), United States and EPO (European Patent Office). Its main competitors in its focus markets computer technology, semiconductors and basic communication technologies are TRON INTELLIGENCE INC, ID SOLUTIONS INC and PLETTNER ANDREAS.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 11 | |
#2 | United States | 6 | |
#3 | EPO (European Patent Office) | 4 | |
#4 | Taiwan | 4 | |
#5 | Republic of Korea | 2 |
# | Industry | |
---|---|---|
#1 | Computer technology | |
#2 | Semiconductors | |
#3 | Basic communication technologies | |
#4 | Audio-visual technology | |
#5 | Packaging and shipping |
# | Name | Total Patents |
---|---|---|
#1 | Li Yangyuan | 24 |
#2 | Ding Shaobo | 7 |
#3 | Xu Kefeng | 6 |
#4 | Li Yang-Yuan | 3 |
#5 | Xu Ke-Feng | 2 |
#6 | Jiang Zhou | 2 |
#7 | Pi Mengyue | 1 |
#8 | Zhang He | 1 |
#9 | Pi Meng-Yue | 1 |
#10 | Chen Minghan | 1 |
Publication | Filing date | Title |
---|---|---|
WO2019128414A1 | Fingerprint sensor | |
WO2019080764A1 | Sensing method of sensor, electronic apparatus, storage medium and terminal device | |
WO2019062932A1 | Fingerprint sensor and driving method therefor | |
WO2018196630A1 | Sensor package structure manufacturing method and sensor package structure | |
WO2018171547A1 | Wafer-level chip encapsulating structure and manufacturing method therefor | |
WO2018149378A1 | Plastic packaging material transferring apparatus and method | |
TW201702850A | Capacitive fingerprint sensor with integrator | |
KR20180025845A | Fingerprint Recognition Module |