PLETTNER ANDREAS has a total of 18 patent applications. Its first patent ever was published in 1997. It filed its patents most often in Germany, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets computer technology, semiconductors and telecommunications are ID SOLUTIONS INC, UPM RAFSEC OY and DYNACARD CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | Germany | 6 | |
#2 | WIPO (World Intellectual Property Organization) | 4 | |
#3 | Australia | 2 | |
#4 | Canada | 2 | |
#5 | EPO (European Patent Office) | 2 | |
#6 | China | 1 | |
#7 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Computer technology | |
#2 | Semiconductors | |
#3 | Telecommunications | |
#4 | Control | |
#5 | Machines | |
#6 | IT methods for management | |
#7 | Measurement |
# | Technology | |
---|---|---|
#1 | Data recognition and presentation | |
#2 | Semiconductor devices | |
#3 | Unspecified technologies | |
#4 | Antennas | |
#5 | Registering devices | |
#6 | Data processing systems | |
#7 | Special measuring |
# | Name | Total Patents |
---|---|---|
#1 | Plettner Andreas | 17 |
#2 | Galeotti Giovanni | 3 |
#3 | Schwaab Gilbert | 3 |
#4 | Haberger Karl | 3 |
#5 | Stemmer Christoph | 3 |
#6 | Stein Arno | 1 |
Publication | Filing date | Title |
---|---|---|
AU7662700A | Method for production of contactless chip cards and for production of electricalunits comprising chips with contact elements | |
DE10022435A1 | Computer-supported preparation of appointment arrangements between visitors and exhibitors at e.g. trade fair, involves updating specific exhibitor schedules based on inquiries by visitors via client computer | |
DE10019661A1 | Procedure for performing an access control | |
DE10014620A1 | Electronic chip carrier band manufacturing method has contact elements for applied chips provided by metallized plastics foil or metal foil | |
DE10012967A1 | Transponder used in radio frequency identification system, includes coupling elements connected to chip surface, and structurally designed to act as dipole antenna and disk capacitor | |
DE19948555A1 | Semiconductor chip manufacturing method has contact elements for connecting chip to external electrical components provided before separation of chip from semiconductor wafer | |
DE19713799A1 | Data recorder |