| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 5 | |
| #2 | United Kingdom | 4 | |
| #3 | Taiwan | 2 | |
| #4 | Hong Kong | 1 | |
| #5 | Republic of Korea | 1 | |
| #6 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Semiconductors | |
| #3 | Machine tools |
| # | Technology | |
|---|---|---|
| #1 | Shaping of plastics | |
| #2 | Semiconductor devices | |
| #3 | Unspecified technologies | |
| #4 | Cutting | |
| #5 | Sawing |
| # | Name | Total Patents |
|---|---|---|
| #1 | Neu H Karl | 6 |
| #2 | Neu Horst Karl | 5 |
| #3 | H Karl Neu | 1 |
| #4 | Neu H Kral | 1 |
| Publication | Filing date | Title |
|---|---|---|
| GB9608536D0 | Carrier strip trimming | |
| SG30365A1 | Encapsulation molding equipment and method | |
| GB9814587D0 | Encapsulation molding equipment | |
| US5429488A | Encapsulating molding equipment and method | |
| US5409362A | Encapsulation molding equipment | |
| GB9407839D0 | Encapsulation molding equipment and method | |
| US5405255A | Encapsulaton molding equipment | |
| US5316463A | Encapsulating molding equipment |